Sealing material to metal bonding compositions and methods for bonding a sealing material to a metal surface

ABSTRACT

A downhole well tool having a component with a metal surface to which a sealing material is adhered is disclosed. The sealing material is bonded to the metal surface through the use of an energetic material disposed between the sealing material and the metal surface. Upon activation or initiation of the energetic material, the sealing material becomes bonded to the metal surface. A plastic layer may be disposed between the sealing material and the metal surface to facilitate bonding sealing material to the metal surface. The energetic material is used to bond the plastic layer to the metal surface and may be used to bond the plastic layer to the sealing material.

BACKGROUND

1. Field of Invention

The invention is directed to materials and methods for bonding a sealingmaterial to a metal surface of downhole tools, such as a packer having asealing element and, in particular, materials and methods for bonding asealing material to a metal surface of downhole tools that remaineffective at temperatures greater than 400° F.

2. Description of Art

Sealing materials are routinely bonded or adhered to a metal surface ofdownhole tools. To adhere or bond the sealing material to the steelhousing of a downhole tool, for example, the prior art tools usedchemical bonding or adhesion components to secure the sealing materialto the steel housing. These chemical compounds, however, become lesseffective as the temperature increases, especially where the temperatureincreases above 400° F., such as those temperatures found in deep oiland gas well. Current technology limits the ability to bond a sealingmaterial such as rubber to steel at such high temperatures. For example,even though there are high temperature chemical adhesion compounds,these compounds do not work effectively for sealing material-to-metalcontact. As a result, the adhesion of the sealing material to the outersurface of the downhole tool is compromised and the sealing material isreleased from the outer surface of the downhole tool. Accordingly, thetool becomes inoperable or ineffective.

Additionally, fluids within the well that flow around and past thedownhole tools, either flowing up the well or down the well, slowlyundermine the chemical compound securing the sealing material to theouter surface of the downhole tools. The flowing fluids may dissolve orotherwise prevent the chemical compound from maintaining its bondingcapabilities. Further, the flowing fluids may force themselves, togetherwith debris carried in the flowing fluids, between the interface of thesealing material with the metal surface of the downhole tool. Therefore,the flowing fluid, either alone or in combination with elevatedtemperatures within the well, can cause the bond of the sealing materialto the metal surface to weaken, thereby causing the seal to leak and,thus, rendering the tool inoperable or ineffective. As a result, costsare increased for replacing and repairing, if possible, the damageddownhole tool having an insufficiently secured sealing material to metalwall surface of the downhole tool.

Accordingly, prior to the development of the materials and downholetools disclosed herein, there have been no downhole tools having asealing material secured to the metal outer wall surface of a downholetool that: increases the life of the downhole tool by increasing thelength of time the sealing material remains bonded to a metal wallsurface of the downhole tools and, thus, decreases the costs associatedwith replacing and repairing the downhole tools; and provides moreeffective bonding of the sealing material at elevated temperatures.Therefore, the art has sought downhole tools having a sealing materialsecured to a metal wall surface of a downhole tool that: increase thelife of the downhole tool by increasing the length of time the sealingmaterial remains bonded to the metal wall surface of the downhole toolsand, thus, decrease the costs associated with replacing and repairingthe downhole tools; and provide more effective bonding of the sealingmaterial at elevated temperatures.

SUMMARY OF INVENTION

Broadly, the downhole tools disclosed herein include a sealing materialsecured to a metal surface of the downhole tool through the use of anenergetic material disposed between the sealing material and the metalsurface and subsequently initiating the energetic material to bond thesealing material to the metal surface. In one embodiment, the sealingmaterial is bonded directly to the metal surface. In another embodiment,the sealing material is first bonded to a plastic material, such asthrough the use of a high-temperature chemical bonding agent or theenergetic material, and the plastic material is then bonded to the metalsurface using the energetic material. In an additional specificembodiment, a plastic material is first bonded to the metal surfaceusing the energetic material and the sealing material is then bonded tothe plastic. In yet another specific embodiment, the sealing material isbonded to the plastic simultaneously with the plastic being bonded tothe metal surface.

The foregoing downhole tools having a sealing material secured to ametal wall surface of a downhole tool have the advantages of: increasingthe life of the downhole tool by increasing the length of time thesealing material remains bonded to the metal wall surface of thedownhole tools and, thus, decreasing the costs associated with replacingand repairing the downhole tools; and providing more effective bondingof the sealing material at elevated temperatures.

In accordance with the disclosure herein, one or more of the foregoingadvantages may also be achieved through the present component of adownhole tool. The component comprises a metal surface, a sealingmaterial, and an energetic material, wherein the energetic materialbonds the sealing material to the metal surface through activation,e.g., combustion or chemical reaction, of the energetic material.

A further feature of the downhole tool component is that the energeticmaterial may comprise a thermite. Another feature of the downhole toolcomponent is that the thermite may comprise sub-micron thermiteparticles. An additional feature of the downhole tool component is thatthe energetic material may comprise at least one reactant for forming anintermetallic compound. Still another feature of the downhole toolcomponent is that at least one of the at least one reactants for formingthe intermetallic compound may comprise sub-micron reactant compoundparticles. A further feature of the downhole tool component is that thesealing material may be selected from the group consisting ofstyrene-butadiene copolymer, neoprene, nitrile rubber, butyl rubber,polysulfide rubber, cis-1,4-polyisoprene, ethylene-propyleneterpolymers, EPDM rubber, silicone rubber, polyurethane rubber, andthermoplastic polyolefin rubbers. Another feature of the downhole toolcomponent is that the durometer hardness of the sealing material may bein the range from about 60 to 100 Shore A. An additional feature of thedownhole tool component is that the metal surface may be disposed on anouter surface of a housing of the downhole tool. Still another featureof the downhole tool component is that the downhole tool may be asealing device. A further feature of the downhole tool component is thatthe sealing device may be a packer. Another feature of the downhole toolcomponent is that the sealing material may be bonded directly to themetal surface by the energetic material, and the energetic material maybe capable of generating sufficient heat to cause the sealing materialto at least partially melt and become bonded to the metal surfacewithout an outer surface of the sealing material melting. An additionalfeature of the downhole tool component is that the downhole toolcomponent may further comprise a plastic layer disposed between thesealing material and the metal surface, the plastic layer being bondeddirectly to the metal surface by the energetic material.

In accordance with the disclosure herein, one or more of the foregoingadvantages may also be achieved through the present method of bonding asealing material to a metal surface of a component of a downhole tool.The method comprises the steps of: (a) disposing an energetic materialbetween a sealing material and a metal surface of a component of adownhole tool; and (b) energizing the energetic material to createsufficient heat to cause the sealing material to be bonded to the metalsurface of the component of the downhole tool.

A further feature of the method of bonding a sealing material to a metalsurface of a component of a downhole tool is that wherein the sealingmaterial may be first bonded to a plastic layer and the energeticmaterial is disposed between the plastic layer and the metal surface ofthe component of the downhole tool prior to step (b). Another feature ofthe method of bonding a sealing material to a metal surface of acomponent of a downhole tool is that the metal surface of the componentof the downhole tool may be first bonded to a plastic layer by disposingthe energetic material between the plastic layer and the metal surfaceof the component of the downhole tool; the energetic material may thenbe energized to bond the plastic layer to the metal surface of thecomponent of the downhole tool; and the sealing material may then bebonded to the plastic layer. An additional feature of the method ofbonding a sealing material to a metal surface of a component of adownhole tool is that the plastic layer may be a perfluoroalkoxymaterial. Still another feature of the method of bonding a sealingmaterial to a metal surface of a component of a downhole tool is thatthe sealing material may be bonded to the plastic layer by disposingadditional energetic material between the sealing material and theplastic layer and energizing the energetic material. A further featureof the method of bonding a sealing material to a metal surface of acomponent of a downhole tool is that the energetic material may comprisea thermite. Another feature of the method of bonding a sealing materialto a metal surface of a component of a downhole tool is that theenergetic material may comprise at least one reactant for forming anintermetallic compound. An additional feature of the method of bonding asealing material to a metal surface of a component of a downhole tool isthat a bonding metal may be disposed on a bonding surface of the sealingmaterial prior to step (b).

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a partial cross-sectional view of a packer showing a seal ringdisposed on the outer surface of the downhole tool, the seal ring havinga metal surface with a sealing material bonded thereto.

FIG. 2 is partial cross-sectional top view of one specific embodiment ofa seal ring of the downhole tool of FIG. 1 showing an energetic materialdisposed between a sealing material and a metal surface of the seal ringprior to bonding the sealing material to the metal surface.

FIG. 3 is a partial cross-sectional top view of the seal ring shown inFIG. 2 after initiation of the energetic material and, thus, bonding ofthe sealing material to the metal surface.

FIG. 4 is partial cross-sectional top view of another specificembodiment of a seal ring of the downhole tool of FIG. 1 showing asealing material bonded to a plastic layer and an energetic materialdisposed between the plastic layer and a metal surface of the seal ringprior to bonding the plastic layer to the metal surface.

FIG. 5 is a partial cross-sectional top view of the seal ring shown inFIG. 4 after initiation of the energetic material and, thus, bonding ofthe sealing material to the metal surface.

FIG. 6 is partial cross-sectional top view of an additional specificembodiment of a seal ring of the downhole tool of FIG. 1 showing asealing material bonded to a plastic layer and an energetic materialdisposed between the plastic layer and a metal surface, as well asbetween the plastic layer and the sealing material, of the seal ringprior to bonding the plastic layer to the metal surface.

FIG. 7 is partial cross-sectional top view of an additional specificembodiment of a seal ring of the downhole tool of FIG. 1 showing asealing material bonded to a metal layer and an energetic materialdisposed between the metal layer and a metal surface of the seal ringprior to bonding the sealing material to the metal surface.

While the invention will be described in connection with the preferredembodiments, it will be understood that it is not intended to limit theinvention to that embodiment. On the contrary, it is intended to coverall alternatives, modifications, and equivalents, as may be includedwithin the spirit and scope of the invention as defined by the appendedclaims.

DETAILED DESCRIPTION OF INVENTION

Referring now to FIG. 1, a downhole tool, such as a packer 10, includesa body or housing 12 and a sealing member or seal ring 22 disposed onthe outer surface of housing 12 for sealing against a surrounding wellcasing. Housing 12 is generally cylindrical but may be any shape desiredor necessary to form the downhole tool. An actuating member 14 ismounted to housing 12 for axial movement relative to housing 12. In thisexample, actuating member 14 engages a lower end of seal ring 22 forpushing seal ring 22 upward on a stationary cam surface 16 of housing 12to cause seal ring 22 to expand radially into the set position. Camsurface 16 is preferably conical. Actuating member 14 may be an annularcollet that is radially expansible, or it could be other configurations.In this embodiment, actuating member 14 is secured to a piston (notshown) supplied with hydraulic pressure for moving seal ring 22 relativeto cam surface 16.

Tool 10 may be of a conventional design, and actuating member 14 may bemoved by a variety of means other than hydraulic pressure, such asemploying the weight of the running string (not shown) for tool 10,hydrostatic wellbore pressure, wireline movement, or explosives. Also,although seal ring 22 is shown moving upward onto stationary cam surface16, the arrangement could be reversed, with seal ring 22 being moveddownward. Further, seal ring 22 could be held axially stationary and camsurface 16 be moved relative to seal ring 22. For example, actuatingmember 14 may actually be held stationary while the running string andhousing 12 move downward relative to seal ring 22, pushing seal ring 22farther onto conical cam surface 16. Alternately, actuating member 14may move upward relative to seal 22. Regardless of the arrangement,while being set, seal ring 22 and cam surface 16 move axially relativeto each other to deform seal ring 22 radially outward to a largerdiameter for engaging an inner wall surface of an outer tubular member(not shown) into which tool 10 is lowered. Outer tubular member may be astring of casing. As shown in FIG. 1, tool 10 in this example also has aset of slips 20 that expand outward and frictionally grip the inner wallsurface of the outer tubular member.

With reference to FIG. 2, seal ring 22 has an internal metal reinforcingelement 23, thus providing a metal surface. Preferably reinforcingelement 23 is formed of a carbon steel. A sealing material 26 is bondedto the metal surface of reinforcing element 23 through the use of anenergetic material (discussed in greater detail below).

Sealing material 26 may be any material known to persons of ordinaryskill in the art. In the preferred embodiment, sealing material 26 is aresilient, elastomeric or polymeric material of a commercially availabletype that will withstand high temperatures that occur in some wells. Forexample, sealing material 26 may be a perfluoro elastomer, astyrene-butadiene copolymer,

neoprene, nitrile rubber, butyl rubber, polysulfide rubber,cis-1,4-polyisoprene, ethylene-propylene terpolymers, EPDM rubber,silicone rubber, polyurethane rubber, or thermoplastic polyolefinrubbers. Preferably, the durometer hardness of sealing material 26 is inthe range from about 60 to 100 Shore A and more particularly from 85 to95 Shore A. In one embodiment, the durometer hardness is about 90 ShoreA. Other suitable sealing materials 26 include Teflon®(polytetrafluroethylene or fluorinated ethylene-propylene) and polyetherether ketone. Sealing material 26 also could be nitrile rubber. Further,sealing material 26 may be any other thermoset material, thermoplasticmaterial, or vulcanized material, provided such sealing materials areresilient and capable of withstanding high temperatures, e.g., greaterthan 400° F.

Energetic material 30 is any material that is capable of quicklygenerating and, thus, releasing large amounts of energy in a localizedarea such that any material contacting the energetic material is heatedto a temperature sufficiently high to bond the material to a metalsurface. Energetic materials include, but are not limited to, thermitematerials and reactants for forming intermetallic compounds.

Thermite reactions typically consist of a metal reacting with a metaloxide to produce a metal and metal oxide with the release of asubstantial amount of energy and can typically be characterized by theformula:

aX+bYZ→cY+dXZ+ΔE kJ

Examples of such reactions include, but are not limited to:

4Al+3BiO₂→3Bi+2Al₂O₃

2Al+MoO₃→Mo Al₂O3

4Al+3FeO₂→3Fe+2Al₂O₃

Although the foregoing examples show aluminum as the metal for thereaction, persons of ordinary skill in the art will recognize thatsimilar thermite reactions of other materials exist, e.g., tungsten,zirconium, copper, magnesium, and manganese. Likewise, the oxide of thereaction may be any suitable and known oxide.

In a preferred embodiment, the thermite material is made up of thermiteparticles having a sub-micron particle size distribution and, morepreferably, a nanometer size distribution. The sub-micron sized thermiteparticles have a substantially lower activation energy requirement andreact faster, usually more than an order of magnitude faster, thanthermite particles having a micron or greater particle sizedistribution.

Other energetic materials 30 include reactants that form anintermetallic compounds upon the reactants being activated or energized.Intermetallic compound reactions are known in the art. Briefly,intermetallic compound reactions involve two metal reactants reactingtogether to form a solid state intermetallic compound and which, in theprocess, release energy. Generally, intermetallic compound reactions canbe characterized by the formula:

aX+bY→dXY+ΔE kJ or

aX+bY+cZ→dXYZ+ΔE kJ

One of the most common intermetallic compound reactions is:

Ni+Sn→NiSn

In a preferred embodiment, both reactants for forming the intermetalliccompounds, e.g., Ni and Sn in the example above, are disposed togetheron the same surface. It is to be understood, however, that the reactantsmay initially be disposed on separate surfaces, e.g., one on the metalsurface and the other on sealing material 26, provided that all of thereactants necessary to form the intermetallic compound are placed incontact with each other, or in close proximity to each other, prior toactivation of the reactants.

In another preferred embodiment, at least one, and more preferably all,of the reactants for forming the intermetallic compounds, is made up ofreactant particles having a sub-micron particle size distribution and,more preferably, a nanometer size distribution. The sub-micron sizedreactant particles have a substantially lower activation energyrequirement and react faster, usually more than an order of magnitudefaster, than reactant particles having a micron or greater particle sizedistribution.

Both the thermite materials and the reactants for forming theintermetallic compounds are available in powder or sheet form fromNovaCentrix of Austin, Tex., Sigma-Aldrich of St. Louis, Mo., andReactive Nanotechnologies, Inc. of Hunt Valley, Md. In the powderedform, at least one of the components typically has particles that aresub-micron to nano-scale range. In sheet form, the components aretypically layered in sub-micron to nano-scale layers.

As illustrated in FIGS. 2-3, in one specific embodiment, sealingmaterial 26 is bonded directly to metal surface 32 of reinforcing ring22 by placing energetic material 30 between sealing material 26 andmetal surface 32 as shown in FIG. 2. Energetic material 30 is initiatedor ignited through means known to persons of ordinary skill in the art.For example, an electric charge or radiant heat may be used to energizeenergetic material 30, causing the energy releasing reaction to begin.The energy released by the energetic material is in the form of heat.Therefore, the temperature along metal surface 32 and bonding surface 34of the sealing material 26 increases until sealing material 26 bonds tometal surface 32 (FIG. 3). The bonding of the sealing material 26 may beachieved through localized melting (where sealing material 26 is formedof a meltable material such as a thermoplastic material) or thermaldegradation (where sealing material 26 is non-meltable material such asa vulcanized, elastomeric, or thermoset material) of sealing material 26or melting of metal surface 32.

Preferably, energetic material 30 is a high temperature, fast burning orchemically reactive material such that energetic material 30 reacts orcombusts in a short amount of time, yet releases a large amount ofenergy to create a high localized temperature. One advantage of heatingsealing material 26 in this manner is that bonding surface 34 is heatedquickly such that the heat dissipates before the entire sealing material26 melts or undergoes thermal degradation. Thus, outer surface 38 ofsealing material 26 maintains its integrity and resilience. Personsskilled in the art, without undue experimentation, can easily determinethe optimum type and volume of energetic material 30 for use with thedesired sealing material 26 or plastic layer 50 (discussed in greaterdetail below).

In an additional embodiment shown in FIG. 7, layer 29 of metal can bedeposited on bonding surface 34 of sealing material 26 to provide ametal to metal bonding through the use of energetic material 30. In thisembodiment, a thin layer of metal (not shown) is deposited on bondingsurface 34 through sputter or chemical vapor deposition processes knownto persons of ordinary skill in the art. The metal being deposited onbonding surface 34 can be a common metal alloy or a material such assolder or brazing compound. Energetic material 30 is then disposedbetween metal surface 32 and sealing material 26 such that bondingsurface 34 with the metal layer deposited thereon is in contact withenergetic material 30. Energetic material 30 can then be initiated orignited, thereby releasing heat and causing metal surface 32 to bond tosealing material 26 through the interface of the metal deposited onbonding surface 34 of sealing material 26.

In another embodiment shown in FIGS. 4-5, plastic layer 50 is disposedbetween sealing material 26 and metal surface 32. Energetic material 30is disposed between plastic layer 50 and metal surface 32 and,therefore, plastic layer 50 is bonded to metal surface 32 in the samemanner as discussed above with respect to the embodiment shown in FIGS.2-3.

Plastic layer 50 is preferably formed of a melt processable material.The term “melt processable” is used herein to mean a material that iscapable of melting and shaping, but becomes thermally stable, i.e., notable to melt, as the downhole application temperature. Thus, the “meltprocessable” materials after bonding sealing material 26 to metalsurface 32, do not re-melt when the tool 10 is disposed downhole. Such“melt processable” materials include thermoset materials as well asthermoplastic materials, provided the melting point, or meltingtemperature, of the thermoplastic materials is greater than the downholewellbore temperature where tool 10 is to be operated.

A preferred plastic layer 50 is formed of a perfluroalkoxy material(“PFA”). Polyamidazole may also be used to form plastic layer 50.Plastic layer may also be formed out of fluorinated ethylene propylene(FEP); Chlorotrifluorethylene (CTFE); Ethylenechlorotrifluoroethylene(ECTFE); Ethylenetetrafluoroethylene (ETFE); or Polyvinylidine fluoride(PVF₂). Regardless of the material or type of plastic layer 50 utilized,plastic layer 50 will always be different from sealing material 26.

In one specific embodiment, sealing material 26 is bonded to plasticlayer 50 by placing a second layer of energetic material 31 (FIG. 6)between sealing material 26 and plastic layer 50. Sealing material 26 isbonded to plastic layer 50 in the same manner as discussed above withrespect to plastic layer 50 being bonded to metal surface 32. Theresulting seal ring 22 has a cross-section as shown in FIG. 5.

In yet another embodiment, sealing material 26 may be bonded to plasticlayer 50 with conventional chemical or adhesive bonding. Because thebonding of sealing material 26 is to the plastic layer 50, known hightemperature chemical bonding agents that are capable of withstandingtemperatures greater than 400° F. when bonding plastic and elastomers,but are unable to withstand such temperatures when bondingplastic/sealing materials to metal surfaces, can be used.

In bonding sealing material 26 to metal surface 32 in accordance withthe embodiment shown in FIGS. 4-5, the order of bonding is not critical.For example, plastic layer 50 may be bonded to sealing material 26 priorto plastic layer 50 being bonded to metal surface 32. Alternatively,plastic layer 50 may be bonded to metal surface 32 prior to plasticlayer 50 being bonded to sealing material 26. In still anotherembodiment, plastic layer 50 is bonded to both sealing material 26 andmetal surface 32 simultaneously, such as through simultaneous initiationof energetic material 30 disposed between both plastic layer 50 andmetal surface 32 and plastic layer 50 and sealing material 26.

Sealing material 26 bonded to metal surface 32 in accordance with theforegoing embodiments are capable of remaining bonded to metal surface32 at temperatures in excess of 400° F. and, preferably, at temperaturesin excess of 450° F.

It is to be understood that the invention is not limited to the exactdetails of construction, operation, exact materials, or embodimentsshown and described, as modifications and equivalents will be apparentto one skilled in the art. For example, as mentioned, the energeticmaterial may be used to bond a sealing material to any component of adownhole hole having a metal surface to which a sealing material isbonded. Moreover, the component of the downhole tool may be anystructural component of the downhole tool, such as the outer wallsurface of the downhole tool itself, and is not limited to the seal ringdiscussed herein. Additionally, chemical bonding agents may be used incombination with the energetic material to bond the sealing material toa plastic layer which is bonded to the metal surface. Further, thesealing material may be any material known to persons of ordinary skillin the art that is capable of providing the necessary function of thesealing material with respect to the specific downhole tool to which itis bonded. Accordingly, the invention is therefore to be limited only bythe scope of the appended claims.

1. A component of a downhole tool, the component comprising: a metalsurface; a sealing material; and an energetic material, wherein theenergetic material bonds the sealing material to the metal surfacethrough activation of the energetic material.
 2. The downhole toolcomponent of claim 1, wherein the energetic material comprises athermite.
 3. The downhole tool component of claim 2, wherein thethermite comprises sub-micron thermite particles.
 4. The downhole toolcomponent of claim 1, wherein the energetic material comprises at leastone reactant for forming an intermetallic compound.
 5. The downhole toolcomponent of claim 4, wherein at least one of the at least one reactantsfor forming the intermetallic compound comprises sub-micron reactantcompound particles.
 6. The downhole tool component of claim 1, whereinthe sealing material is selected from the group consisting ofstyrene-butadiene copolymer, neoprene, nitrile rubber, butyl rubber,polysulfide rubber, cis-1,4-polyisoprene, ethylene-propyleneterpolymers, EPDM rubber, silicone rubber, polyurethane rubber, andthermoplastic polyolefin rubbers.
 7. The downhole tool component ofclaim 6, wherein the durometer hardness of the sealing material is inthe range from about 60 to 100 Shore A.
 8. The downhole tool componentof claim 1, wherein the metal surface is disposed on an outer surface ofa housing of the downhole tool.
 9. The downhole tool component of claim8, wherein the downhole tool is a sealing device.
 10. The downhole toolcomponent of claim 9, wherein the sealing device is a packer.
 11. Thedownhole tool component of claim 1, wherein the sealing material isbonded directly to the metal surface by the energetic material, and theenergetic material is capable of generating sufficient heat to cause thesealing material to at least partially melt and become bonded to themetal surface without an outer surface of the sealing material melting.12. The downhole tool component of claim 1, further comprising a plasticlayer disposed between the sealing material and the metal surface, theplastic layer being bonded directly to the metal surface by theenergetic material.
 13. A method of bonding a sealing material to ametal surface of a component of a downhole tool, the method comprisingthe steps of: (a) disposing an energetic material between a sealingmaterial and a metal surface of a component of a downhole tool; and (b)energizing the energetic material to create sufficient heat to cause thesealing material to be bonded to the metal surface of the component ofthe downhole tool.
 14. The method of claim 13, wherein the sealingmaterial is first bonded to a plastic layer and the energetic materialis disposed between the plastic layer and the metal surface of thecomponent of the downhole tool prior to step (b).
 15. The method ofclaim 13, wherein the metal surface of the component of the downholetool is first bonded to a plastic layer by disposing the energeticmaterial between the plastic layer and the metal surface of thecomponent of the downhole tool; the energetic material is then energizedto bond the plastic layer to the metal surface of the component of thedownhole tool; and the sealing material is then bonded to the plasticlayer.
 16. The method of claim 15, wherein the plastic layer is aperfluoroalkoxy material.
 17. The method of claim 15, wherein thesealing material is bonded to the plastic layer by disposing additionalenergetic material between the sealing material and the plastic layerand energizing the energetic material.
 18. The method of claim 15,wherein the energetic material comprises a thermite.
 19. The method ofclaim 15, wherein the energetic material comprises at least one reactantfor forming an intermetallic compound.
 20. The method of claim 13,wherein a bonding metal is disposed on a bonding surface of the sealingmaterial prior to step (b).